The Intel Core i5-600 desktop processor series are the next generation of 64-bit, multi-core processors built on 32-nanometer process technology.

Based on the low-power/high-performance Intel microarchitecture, the processor is designed for a two-chip platform, instead of the traditional three-chip platforms (processor, (G)MCH, and ICH). The two-chip platform consists of a processor and Platform Controller Hub (PCH) and enables higher performance, easier validation, and improved x-y footprint.

The Intel® 5 Series Chipset components for desktop and Intel® 3400 Series Chipset components for workstations are the PCH. The processor is designed for desktop and workstation platforms.

Included in this family of processors is an integrated graphics and a memory controller die on the same package as the processor core die. This two-chip solution of a processor core die with an integrated graphics and a memory controller die is known as a Multi-Chip Package (MCP) processor.

Specifications:

Essentials:

Status: Launched
Launch Date: Q1'10
Processor Number: i5-650
# of Cores: 2
# of Threads: 4
Clock Speed: 3.20GHz
Max Turbo Frequency: 3.46GHz
Intel® Smart Cache: 4 MB
Bus/Core Ratio: 24
DMI: 2.5 GT/s
Instruction Set: 64-bit
Instruction Set Extensions: SSE4.2
Embedded Options Available: No
Lithography: 32 nm
Max TDP: 73 W
VID Voltage Range: 0.6500V-1.4000V

Memory Specifications:

Max Memory Size (dependent on memory type): 16 GB
Memory Types: DDR3-1066/1333
# of Memory Channels: 2
Max Memory Bandwidth: 21 GB/s
Physical Address Extensions: 36-bit

Graphics Specifications:

Integrated Graphics: Yes
Graphics Base Frequency: 733 MHz
Intel® Flexible Display Interface (Intel® FDI): Yes
Intel® Clear Video HD Technology: Yes
Dual Display Capable: Yes

Expansion Options:

PCI Express Revision: 2.0
PCI Express Configurations: 1x16, 2x8
# of PCI Express Ports: 1

Package Specifications:

Max CPU Configuration: 1
TCASE: 72.6°C
Package Size: 37.5mm x 37.5mm
Processing Die Size: 81 mm2
# of Processing Die Transistors: 382 million
Graphics and IMC Lithography: 45 nm
Graphics and IMC Die Size: 114 mm2
# of Graphics and IMC Die Transistors: 177 million
Sockets Supported: FCLGA1156
Halogen Free Options Available: Yes

Advanced Technologies:

Intel® Turbo Boost Technology: Yes
Intel® Hyper-Threading Technology: Yes
Intel® Virtualization Technology (VT-x): Yes
Intel® Virtualization Technology for Directed I/O (VT-d): Yes
Intel® Trusted Execution Technology: Yes
AES New Instructions: Yes
Intel® 64: Yes
Idle States: Yes
Enhanced Intel SpeedStep® Technology: Yes
Intel® Demand Based Switching: No
Thermal Monitoring Technologies: No
Execute Disable Bit: Yes