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The Intel® Core™2 Duo processor E7000 series are based on the Enhanced Intel® Core™ microarchitecture. The Intel Enhanced Core™ microarchitecture combines the performance of previous generation Desktop products with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems. The Intel® Core™2 Duo processor E7000 series are 64-bit processors that maintain compatibility with IA-32 software.
The processors use Flip-Chip Land Grid Array (FC-LGA8) package technology, and plugs into a 775-land surface mount, Land Grid Array (LGA) socket, referred to as the LGA775 socket.
The processors are based on 45 nm process technology. The processors feature the Intel Advanced Smart Cache, a shared multi-core optimized cache that significantly reduces latency to frequently used data. The Intel Core™2 Duo processor E7000 series feature a 1333 MHz and 1066 MHz front side bus (FSB) and 3 MB of L2 cache. The processors support all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), Supplemental Streaming SIMD Extension 3 (SSSE3), and the Streaming SIMD Extensions 4.1 (SSE4.1). The processors support several Advanced Technologies: Execute Disable Bit, Intel 64 architecture, and Enhanced Intel SpeedStep® Technology.
The processor's front side bus (FSB) use a split-transaction, deferred reply protocol. The FSB uses Source-Synchronous Transfer of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s.
Specifications:
Essentials:
Status: Launched
Launch Date: Q1'09
Processor Number: E7500
# of Cores: 2
# of Threads: 2
Clock Speed: 2.93GHz
L2 Cache: 3 MB
Bus/Core Ratio: 11
FSB Speed: 1066 MHz
FSB Parity: No
Instruction Set: 64-bit
Embedded Options Available: No
Supplemental SKU: No
Lithography: 45 nm
Max TDP: 65 W
VID Voltage Range: 0.8500V-1.3625V
Package Specifications:
TCASE: 74.1°C
Package Size: 37.5mm x 37.5mm
Processing Die Size: 82 mm2
# of Processing Die Transistors: 228 million
Sockets Supported: LGA775
Halogen Free Options Available: Yes
Advanced Technologies:
Intel® Turbo Boost Technology: No
Intel® Hyper-Threading Technology: No
Intel® Trusted Execution Technology: No
AES New Instructions: No
Intel® 64: Yes
Idle States: Yes
Enhanced Intel SpeedStep® Technology: Yes
Intel® Demand Based Switching: No
Thermal Monitoring Technologies: Yes
Execute Disable Bit: Yes
The processors use Flip-Chip Land Grid Array (FC-LGA8) package technology, and plugs into a 775-land surface mount, Land Grid Array (LGA) socket, referred to as the LGA775 socket.
The processors are based on 45 nm process technology. The processors feature the Intel Advanced Smart Cache, a shared multi-core optimized cache that significantly reduces latency to frequently used data. The Intel Core™2 Duo processor E7000 series feature a 1333 MHz and 1066 MHz front side bus (FSB) and 3 MB of L2 cache. The processors support all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), Supplemental Streaming SIMD Extension 3 (SSSE3), and the Streaming SIMD Extensions 4.1 (SSE4.1). The processors support several Advanced Technologies: Execute Disable Bit, Intel 64 architecture, and Enhanced Intel SpeedStep® Technology.
The processor's front side bus (FSB) use a split-transaction, deferred reply protocol. The FSB uses Source-Synchronous Transfer of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s.
Specifications:
Essentials:
Status: Launched
Launch Date: Q1'09
Processor Number: E7500
# of Cores: 2
# of Threads: 2
Clock Speed: 2.93GHz
L2 Cache: 3 MB
Bus/Core Ratio: 11
FSB Speed: 1066 MHz
FSB Parity: No
Instruction Set: 64-bit
Embedded Options Available: No
Supplemental SKU: No
Lithography: 45 nm
Max TDP: 65 W
VID Voltage Range: 0.8500V-1.3625V
Package Specifications:
TCASE: 74.1°C
Package Size: 37.5mm x 37.5mm
Processing Die Size: 82 mm2
# of Processing Die Transistors: 228 million
Sockets Supported: LGA775
Halogen Free Options Available: Yes
Advanced Technologies:
Intel® Turbo Boost Technology: No
Intel® Hyper-Threading Technology: No
Intel® Trusted Execution Technology: No
AES New Instructions: No
Intel® 64: Yes
Idle States: Yes
Enhanced Intel SpeedStep® Technology: Yes
Intel® Demand Based Switching: No
Thermal Monitoring Technologies: Yes
Execute Disable Bit: Yes
